
Technology
| ITEM | PCB | |
| Layer number | 1-20 Layer | |
| Type of dielectric material | 94hb, 94v0, CEM-1/2/3,FR-4,Teflon | |
| Board thickness | 0.2mm-5.0 mm(4mil-200mil) | |
| PTH hole copper thickness | 1/2 oz min; 3 oz max. | |
| Process size | 2 mm-----2 m | |
| Line width/space(mil) | 0.075mm | |
| Min drilling diameter | 0.1mm(laster) 0.2mm(NC Drill) | |
| Min Punch diameter | 0.9 mm(35mil) | |
| tolerance | Hole position | ±0.075 mm(3mil) |
| Line width | ±0.05 mm(2mil) | |
| Diameter | PTH±0.075 mm(3mil) | |
| NPTH±0.05 mm(2mil) | ||
| Routing dimension tolerance (edge to edge) | ±0.15 mm(6mil) | |
| ±0.10 mm(4mil) | ||
| Bow and twist | 0.70%-1% | |
| Surface treating technic of pad | Nickel/ Gold Plating/ HAL(Osp) | |
| Insulation Resistance | 10K∩-20M∩ | |
| Tolerance of line width | ±1mil(±25um) | |
| Test of voltage | 300V | |
| V-cut | Panel size | 110*100 mm(mil.) |
| 660*600 mm(max.) | ||
| Board thickness | 0.6 mm(24mil)mil | |
| Tolerance | ±0.1mm(4mil) | |
| Drilled slot width | 0.50mm(20mil)max | |
| Angle | 30°,45°,60°,90° | |
| Tolerance of drilled slot (Slot size tol.>=2W) | PTH L: ±0.15 mm(6mil) | |
| W: ±0.1mm(4mil) | ||
| Registration Tolerance of Front/Back image | 0.075mm(3mil) | |
| Multilayer P.C.B | Tolerance of innerlayer to innerlayer | 4 layers:0.15 mm(6mil)max |
| 6 layers:0.025 mm(10mil)max | ||
| Registration of innerlayer to innerlayer | ±3mil (±76um) | |
| Tolerance of Board thicknes | 4 layers: ±0.13mm(5mil) | |
| 6 layers: ±0.15mm(6mil) | ||
| impedance | 50 ohm±10% | |